![Steven C. Schlepp](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Profil
Steven C.
Schlepp formerly worked at Multilayer Technology, Inc., as President & Chief Executive Officer in 2002, Viasystems North America, Inc., as Independent Director from 2011 to 2012, and Toppan West, Inc., as President from 1990 to 1996.
Anciens postes connus de Steven C. Schlepp
| Sociétés | Poste | Fin |
|---|---|---|
Viasystems North America, Inc.
 Viasystems North America, Inc. Electronic ComponentsElectronic Technology Designs, engineers, and manufactures printed circuit boards | Directeur/Membre du Conseil | 31/05/2012 |
Multilayer Technology, Inc.
 Multilayer Technology, Inc. Electronic ComponentsElectronic Technology Engages in the contract manufacturing of printed circuit boards | President | 01/10/2002 |
Toppan West, Inc. | President | 01/01/1996 |
Expériences
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Relations
28
Relations au 1er degré
3
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 3 |
|---|---|
Viasystems North America, Inc.
Viasystems North America, Inc. Electronic ComponentsElectronic Technology Designs, engineers, and manufactures printed circuit boards | Electronic Technology |
Multilayer Technology, Inc.
Multilayer Technology, Inc. Electronic ComponentsElectronic Technology Engages in the contract manufacturing of printed circuit boards | Electronic Technology |
Toppan West, Inc. |
