![Robert H. Bond](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Profil
Robert H.
Bond worked as a VP of Engineering & Manufacturing Operations at UPEK, Inc. and as a Principal at CTU of Delaware, Inc. He received an undergraduate degree from the University of Akron in 1973.
Anciens postes connus de Robert H. Bond
| Sociétés | Poste | Fin |
|---|---|---|
CTU of Delaware, Inc. | Corporate Officer/Principal | - |
UPEK, Inc.
 UPEK, Inc. Miscellaneous Commercial ServicesCommercial Services Provides biometric fingerprint security solutions | Directeur des opérations | 20/10/2009 |
Formation de Robert H. Bond
Expériences
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Relations
32
Relations au 1er degré
3
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 3 |
|---|---|
UPEK, Inc.
UPEK, Inc. Miscellaneous Commercial ServicesCommercial Services Provides biometric fingerprint security solutions | Commercial Services |
University of Akron
 University of Akron Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
CTU of Delaware, Inc. |
