![Hsiao Yu Lo](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Hsiao Yu Lo
President chez
Siliconware USA, Inc.
Profil
Hsiao Yu Lo is currently working as a Director at Siliconware Precision Industries Co., Ltd. since 2011.
Additionally, Dr. Lo is also currently serving as the President at Siliconware USA, Inc. Dr. Lo obtained a doctorate degree from Purdue University.
Postes actifs de Hsiao Yu Lo
| Sociétés | Poste | Début |
|---|---|---|
Siliconware USA, Inc.
 Siliconware USA, Inc. Marine ShippingTransportation The company is based in San Jose, CA. Part of ASE Technology Holding Co., Ltd., Siliconware USA, Inc. provides semiconductor assembly, packaging, testing, and wafer bumping services. The company offers backend IC manufacturing solutions, including advanced packaging technologies such as laminate substrate, leadframe, wafer-level chip scale packaging, stacked die, multi-package ball grid array, and 2.5D/3D integration with through-silicon vias. Its portfolio includes system-in-package, fan-out wafer-level packaging, flip chip, fine pitch wire bonding, molding, and antenna-in-package. Siliconware USA delivers in-house design capabilities, package characterization, reliability testing, and failure analysis. Wafer bumping services support both 200mm and 300mm wafers with various bumping technologies for semiconductor products like GPUs, PMICs, APs, high-performance computing chips, wireless devices, AI servers, IoT, and RFICs. The company serves markets such as computing, mobile devices, telecommunications, consumer electronics, automotive, AI, VR/AR, and IoT. Its operations include certified clean rooms and automated environmental controls. | President | - |
Anciens postes connus de Hsiao Yu Lo
| Sociétés | Poste | Fin |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO, LTD | Directeur/Membre du Conseil | - |
Formation de Hsiao Yu Lo
Expériences
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Relations
2
Relations au 1er degré
3
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 3 |
|---|---|
Siliconware Precision Industries Co., Ltd.
 Siliconware Precision Industries Co., Ltd. SemiconductorsElectronic Technology Operates as a semiconductors assembling and testing company | Electronic Technology |
Purdue University
 Purdue University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
Siliconware USA, Inc.
Siliconware USA, Inc. Marine ShippingTransportation The company is based in San Jose, CA. Part of ASE Technology Holding Co., Ltd., Siliconware USA, Inc. provides semiconductor assembly, packaging, testing, and wafer bumping services. The company offers backend IC manufacturing solutions, including advanced packaging technologies such as laminate substrate, leadframe, wafer-level chip scale packaging, stacked die, multi-package ball grid array, and 2.5D/3D integration with through-silicon vias. Its portfolio includes system-in-package, fan-out wafer-level packaging, flip chip, fine pitch wire bonding, molding, and antenna-in-package. Siliconware USA delivers in-house design capabilities, package characterization, reliability testing, and failure analysis. Wafer bumping services support both 200mm and 300mm wafers with various bumping technologies for semiconductor products like GPUs, PMICs, APs, high-performance computing chips, wireless devices, AI servers, IoT, and RFICs. The company serves markets such as computing, mobile devices, telecommunications, consumer electronics, automotive, AI, VR/AR, and IoT. Its operations include certified clean rooms and automated environmental controls. | Transportation |
