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Charles Whyte
Corporate Officer/Principal chez Vertical Circuits, Inc.
Postes actifs de Charles Whyte
Sociétés | Poste | Début | Fin |
---|---|---|---|
Vertical Circuits, Inc.
![]() Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Corporate Officer/Principal | - | - |
Historique de carrière de Charles Whyte
Anciens postes connus de Charles Whyte
Sociétés | Poste | Début | Fin |
---|---|---|---|
SANDISK CORPORATION | Corporate Officer/Principal | - | - |
Formation de Charles Whyte
The University of Edinburgh | Graduate Degree |
Santa Clara University | Masters Business Admin |
Statistiques
Internationale
Etats-Unis | 4 |
Royaume-Uni | 2 |
Opérationnelle
Corporate Officer/Principal | 2 |
Graduate Degree | 1 |
Masters Business Admin | 1 |
Sectorielle
Electronic Technology | 3 |
Consumer Services | 3 |
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
Entreprise privées | 2 |
---|---|
Vertical Circuits, Inc.
![]() Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Electronic Technology |
SanDisk LLC
![]() SanDisk LLC Computer PeripheralsElectronic Technology SanDisk LLC designs, develops and markets flash memory data storage products. The company was founded by Eli Harari and Sanjay Mehrotra on June 01, 1988 and is headquartered in Irvine, CA. | Electronic Technology |
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