Charles Whyte
Corporate Officer/Principal chez Vertical Circuits, Inc.
Profil
Charles Whyte is currently the Vice President-Product & Test Engineering at Vertical Circuits, Inc. He was previously a Principal at SanDisk LLC.
He graduated from The University of Edinburgh with a graduate degree and also holds an MBA from Santa Clara University.
Postes actifs de Charles Whyte
| Sociétés | Poste | Début |
|---|---|---|
Vertical Circuits, Inc.
 Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Corporate Officer/Principal | - |
Anciens postes connus de Charles Whyte
| Sociétés | Poste | Fin |
|---|---|---|
| SANDISK CORPORATION | Corporate Officer/Principal | - |
Formation de Charles Whyte
| The University of Edinburgh | Graduate Degree |
| Santa Clara University | Masters Business Admin |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 2 |
|---|---|
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Electronic Technology |
SanDisk LLC
 SanDisk LLC Computer PeripheralsElectronic Technology SanDisk LLC designs, develops and markets flash memory data storage products. The company was founded by Eli Harari and Sanjay Mehrotra on June 01, 1988 and is headquartered in Irvine, CA. | Electronic Technology |
