![Bum-Hyuk Im](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Profil
Bum-Hyuk Im is currently Managing Director & Head-Sales at Winpac, Inc. Formerly, served as Managing Director & Head-Packaging Sales at APACT Co., Ltd.
Postes actifs de Bum-Hyuk Im
| Sociétés | Poste | Début |
|---|---|---|
| WINPAC INC. | Sales & Marketing | - |
Anciens postes connus de Bum-Hyuk Im
| Sociétés | Poste | Fin |
|---|---|---|
| APACT CO., LTD. | Sales & Marketing | 31/01/2024 |
Expériences
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
| Entreprise privées | 2 |
|---|---|
APACT Co., Ltd.
 APACT Co., Ltd. Miscellaneous Commercial ServicesCommercial Services Engages in conducting test and engineering service business related to semiconductor manufacturing | Commercial Services |
Winpac, Inc.
 Winpac, Inc. SemiconductorsElectronic Technology Manufactures and wholesales semiconductor products | Electronic Technology |
