![Takashi Shiraishi](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Takashi Shiraishi
Directeur/Membre du Conseil chez Casio Micronics Co., Ltd.
Postes actifs de Takashi Shiraishi
Sociétés | Poste | Début | Fin |
---|---|---|---|
Casio Micronics Co., Ltd.
![]() Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Comptroller/Controller/Auditor | 11/10/2011 | - |
Directeur/Membre du Conseil | 11/10/2011 | - |
Historique de carrière de Takashi Shiraishi
Statistiques
Internationale
Japon | 2 |
Opérationnelle
Comptroller/Controller/Auditor | 1 |
Director/Board Member | 1 |
Sectorielle
Electronic Technology | 2 |
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
Entreprise privées | 1 |
---|---|
Casio Micronics Co., Ltd.
![]() Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Electronic Technology |
- Bourse
- Insiders
- Takashi Shiraishi
- Expérience