![Huang Fulong](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Huang Fulong
Plus aucun poste en cours
Electronic Technology
Profil
Huang Fulong worked as a Director of Operations & Engineering at Shellcase Ltd. and as a Vice President at China Wafer Level CSP Co., Ltd.
Anciens postes connus de Huang Fulong
| Sociétés | Poste | Fin |
|---|---|---|
Shellcase Ltd.
 Shellcase Ltd. SemiconductorsElectronic Technology Manufactures packaging wafers | Directeur des opérations | - |
| CHINA WAFER LEVEL CSP CO., LTD. | Corporate Officer/Principal | - |
Expériences
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
| Entreprise privées | 2 |
|---|---|
Shellcase Ltd.
Shellcase Ltd. SemiconductorsElectronic Technology Manufactures packaging wafers | Electronic Technology |
China Wafer Level CSP Co., Ltd.
 China Wafer Level CSP Co., Ltd. SemiconductorsElectronic Technology Manufactures semiconductor image sensor packaging chips | Electronic Technology |
