Hsiu-Ying Chiu
Corporate Officer/Principal chez SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD.
Postes actifs de Hsiu-Ying Chiu
| Sociétés | Poste | Début | Fin |
|---|---|---|---|
| SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Corporate Officer/Principal | 22/09/2022 | - |
| Président | 25/07/2015 | 22/09/2022 |
Historique de carrière de Hsiu-Ying Chiu
Anciens postes connus de Hsiu-Ying Chiu
| Sociétés | Poste | Début | Fin |
|---|---|---|---|
| TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Directeur/Membre du Conseil | 29/04/2013 | 17/12/2018 |
| CHUNG HWA PULP CORPORATION | Directeur/Membre du Conseil | 08/09/2010 | - |
| BOARDTEK ELECTRONICS CORP | Directeur/Membre du Conseil | 08/09/2010 | - |
| YFY INC. | Directeur/Membre du Conseil | 23/06/2006 | - |
| Président | 23/06/2006 | - | |
| Directeur Financier/CFO | 23/06/2006 | - |
Formation de Hsiu-Ying Chiu
| University of Pittsburgh | Doctorate Degree |
| Carnegie Mellon University | Doctorate Degree |
| National Taiwan University | Doctorate Degree |
Statistiques
Internationale
| Taïwan | 7 |
| Etats-Unis | 3 |
Opérationnelle
| Director/Board Member | 4 |
| Doctorate Degree | 3 |
| Chairman | 2 |
Sectorielle
| Process Industries | 4 |
| Consumer Services | 4 |
| Electronic Technology | 2 |
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
| Sociétés cotées | 4 |
|---|---|
| YFY INC. | Process Industries |
| CHUNG HWA PULP CORPORATION | Process Industries |
| TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Health Technology |
| SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Process Industries |
| Entreprise privées | 1 |
|---|---|
BoardTek Electronics Corp.
 BoardTek Electronics Corp. Electronic ComponentsElectronic Technology BoardTek Electronics Corp. engages in the design, manufacture, and sale of multilayer PCB, single & double-sided PCB, and electronic components. Its products include PCB products, integrated circuit (IC) substrate, and green process and system integration. The PCB products cover high speed digital PCB, high frequency microwave PCB, pre-bond metal PCB, post-bonding metal PCB, coin insertion and embedding, ceramic substrate embedded PCB, and heavy copper PCB. The IC substrate covers flash and memory card substrate, complementary metal-oxide semiconductor (CMOS) image sensor substrate, and light-emitting diode (LED) Substrate. The green process and system integration covers high purity copper oxide, copper concentration control system, and insoluble anode. BoardTek Electronics was founded on June 8, 1987 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |
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