Chia Hsing Lin
Directeur/Membre du Conseil chez WALTON ADVANCED ENGINEERING, INC.
Postes actifs de Chia Hsing Lin
| Sociétés | Poste | Début | Fin |
|---|---|---|---|
| WALTON ADVANCED ENGINEERING, INC. | Directeur/Membre du Conseil | 25/06/2013 | - |
| ZIMMITE TAIWAN LTD. | Directeur/Membre du Conseil | - | - |
| Independent Dir/Board Member | - | - | |
| KINGPAK TECHNOLOGY INC. | Directeur/Membre du Conseil | - | - |
| Independent Dir/Board Member | - | - |
Historique de carrière de Chia Hsing Lin
Formation de Chia Hsing Lin
| Tatung University | Undergraduate Degree |
| National Taiwan University | Masters Business Admin |
Statistiques
Internationale
| Taïwan | 6 |
Opérationnelle
| Director/Board Member | 3 |
| Independent Dir/Board Member | 2 |
| Undergraduate Degree | 1 |
Sectorielle
| Electronic Technology | 3 |
| Consumer Services | 3 |
| Utilities | 2 |
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
| Sociétés cotées | 2 |
|---|---|
| WALTON ADVANCED ENGINEERING, INC. | Electronic Technology |
| ZIMMITE TAIWAN LTD. | Utilities |
| Entreprise privées | 1 |
|---|---|
Kingpak Technology, Inc.
 Kingpak Technology, Inc. SemiconductorsElectronic Technology Kingpak Technology, Inc. engages in the testing and sale of complementary metal-oxide semiconductor (CMOS) image sensor, CMOS image sensors (CIS) and integrated circuit packaging. It mainly focuses on consumer products, wearable products, safety monitoring & automobile related CIS packaging as well as video testing services. The company's products include CMOS image sensor, micro-electro-mechanical systems (MEMS), ball grid array (BGA), and system in package (SiP). Kingpak Technology was founded on May 8, 1991 and is headquartered in Taipei, Taiwan. | Electronic Technology |
- Bourse
- Insiders
- Chia Hsing Lin
- Expérience
