Jay B. Grover
Plus aucun poste en cours
Historique de carrière de Jay B. Grover
Anciens postes connus de Jay B. Grover
| Sociétés | Poste | Début | Fin |
|---|---|---|---|
| FTC SOLAR, INC. | Corporate Officer/Principal | 01/05/2019 | 27/08/2021 |
| SUNEDISON INC | Corporate Officer/Principal | 01/01/2010 | 01/01/2017 |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Directeur des opérations | 01/01/2005 | 01/01/2010 |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | President | 01/01/1997 | 01/01/2005 |
Statistiques
Internationale
| Etats-Unis | 5 |
Opérationnelle
| Corporate Officer/Principal | 2 |
| Chief Operating Officer | 1 |
| President | 1 |
Sectorielle
| Electronic Technology | 3 |
| Technology Services | 2 |
| Utilities | 2 |
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
| Sociétés cotées | 1 |
|---|---|
| FTC SOLAR, INC. | Technology Services |
| Entreprise privées | 3 |
|---|---|
SunEdison, Inc.
 SunEdison, Inc. Alternative Power GenerationUtilities SunEdison, Inc. engages in the provision of renewable-energy services. The company was founded on August 6, 1959 and is headquartered in Maryland Beltsville, MD. | Utilities |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |
AGC Multi Material America, Inc.
AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Technology |
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