Bao Zeng Wang
Directeur/Membre du Conseil chez Henghui Technology Corp. Ltd.
Postes actifs de Bao Zeng Wang
| Sociétés | Poste | Début | Fin |
|---|---|---|---|
Henghui Technology Corp. Ltd.
 Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Directeur/Membre du Conseil | 01/11/2020 | - |
Historique de carrière de Bao Zeng Wang
Formation de Bao Zeng Wang
| Southeast University | Graduate Degree |
Statistiques
Internationale
| Chine | 3 |
Opérationnelle
| Director/Board Member | 1 |
| Graduate Degree | 1 |
Sectorielle
| Producer Manufacturing | 2 |
| Consumer Services | 2 |
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
| Entreprise privées | 1 |
|---|---|
Henghui Technology Corp. Ltd.
Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
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