Wen Zhi Wang
Directeur Financier/CFO chez NINGBO FANGZHENG AUTOMOBILE MOULD CO.,LTD.
Postes actifs de Wen Zhi Wang
| Sociétés | Poste | Début | Fin |
|---|---|---|---|
| NINGBO FANGZHENG AUTOMOBILE MOULD CO.,LTD. | Directeur Financier/CFO | 11/12/2023 | - |
Shenzhen Han’s Assembly & Testing Technology Co., Ltd.
 Shenzhen Han’s Assembly & Testing Technology Co., Ltd. SemiconductorsElectronic Technology Shenzhen Han’s Assembly & Testing Technology Co., Ltd. engages in the manufacture of special equipment for light emitting diode (LED), and semiconductor packaging and testing processes. Its products include wire bonding equipment, die bonding equipment, test taping equipment, and test sorting equipment. The company was founded on September 10, 2007 and is headquartered in Shenzhen, China. | Directeur/Membre du Conseil | 25/01/2022 | - |
| Independent Dir/Board Member | 25/01/2022 | - |
Historique de carrière de Wen Zhi Wang
Anciens postes connus de Wen Zhi Wang
| Sociétés | Poste | Début | Fin |
|---|---|---|---|
| SHENZHEN YINGHE TECHNOLOGY CO., LTD | Directeur Financier/CFO | 15/01/2020 | - |
| SHENZHEN SILVER BASIS TECHNOLOGY CO., LTD. | Directeur Financier/CFO | 01/06/2011 | - |
| Corporate Officer/Principal | - | - |
Statistiques
Internationale
| Chine | 5 |
Opérationnelle
| Director of Finance/CFO | 3 |
| Corporate Officer/Principal | 1 |
| Director/Board Member | 1 |
Sectorielle
| Producer Manufacturing | 3 |
| Consumer Services | 2 |
| Electronic Technology | 2 |
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
| Sociétés cotées | 3 |
|---|---|
| SHENZHEN SILVER BASIS TECHNOLOGY CO., LTD. | Consumer Services |
| SHENZHEN YINGHE TECHNOLOGY CO., LTD | Producer Manufacturing |
| NINGBO FANGZHENG AUTOMOBILE MOULD CO.,LTD. | Producer Manufacturing |
| Entreprise privées | 1 |
|---|---|
Shenzhen Han’s Assembly & Testing Technology Co., Ltd.
Shenzhen Han’s Assembly & Testing Technology Co., Ltd. SemiconductorsElectronic Technology Shenzhen Han’s Assembly & Testing Technology Co., Ltd. engages in the manufacture of special equipment for light emitting diode (LED), and semiconductor packaging and testing processes. Its products include wire bonding equipment, die bonding equipment, test taping equipment, and test sorting equipment. The company was founded on September 10, 2007 and is headquartered in Shenzhen, China. | Electronic Technology |
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