Wei Peng Lin
Directeur Financier/CFO chez MUTUAL-TEK INDUSTRIES CO., LTD.
Profil
Wei Peng Lin is currently the Director, Spokesman, and Head-Finance & Accounting at Mutual-Tek Industries Co., Ltd.
He is also a Member of the Supervisory Board at Mutual-Pak Technology Co., Ltd., Changshu Mutual-Tek Co., Ltd., and Round Day & Distribution Co., Ltd.
Mr. Lin holds an MBA from National Chung Hsing University.
Postes actifs de Wei Peng Lin
Sociétés | Poste | Début |
---|---|---|
MUTUAL-TEK INDUSTRIES CO., LTD. | Directeur Financier/CFO | 28/07/2005 |
Mutual-Pak Technology Co., Ltd.
Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan. | Directeur/Membre du Conseil | - |
Changshu Mutual-Tek Co., Ltd. | Directeur/Membre du Conseil | - |
Round Day & Distribution Co., Ltd. | Directeur/Membre du Conseil | - |
Formation de Wei Peng Lin
National Chung Hsing University | Masters Business Admin |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
Sociétés cotées | 1 |
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MUTUAL-TEK INDUSTRIES CO., LTD. | Electronic Technology |
Entreprise privées | 3 |
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Mutual-Pak Technology Co., Ltd.
Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |
Changshu Mutual-Tek Co., Ltd. | |
Round Day & Distribution Co., Ltd. |