Provenance du réseau au premier degré de Marcus Crayon
Entité | Type d'entité | Industrie | |
---|---|---|---|
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ.
4
| Subsidiary | Semiconductors | 4 |
Graphique Sociétés connectées au second degré
Relation dans plusieurs entreprises
Sociétés connectées à Marcus Crayon via son réseau personnel
Société | Secteur | Personnes liées | Poste principal |
---|---|---|---|
FTC SOLAR, INC. | Packaged Software | Corporate Officer/Principal | |
SUNEDISON INC | Alternative Power Generation | Corporate Officer/Principal | |
AGC Multi Material America, Inc.
AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Components | President |
Statistiques
Internationale
Etats-Unis | 4 |
Sectorielle
Technology Services | 2 |
Utilities | 2 |
Electronic Technology | 2 |
Opérationnelle
Sales & Marketing | 2 |
President | 2 |
Corporate Officer/Principal | 2 |
Director of Finance/CFO | 1 |
Chief Operating Officer | 1 |
Relations les plus connectées
Insiders | |
---|---|
Jay B. Grover | 4 |
Fred Hickman | 1 |
David McComb | 1 |
Greg Marshall | 1 |
- Bourse
- Insiders
- Marcus Crayon
- Connexions Sociétés