Ling Man Pan
Director/Board Member chez Shenzhen Cau Technology Co. Ltd. /Shenzhen/
Profil
Ling Man Pan currently holds a position as an Independent Director at Shenzhen Cau Technology Co. Ltd.
In the past, Ms. Pan has held positions as an Independent Director at Shenzhen Coship Electronics Co., Ltd., Shenzhen Salubris Pharmaceuticals Co., Ltd., and Shenzhen Danbond Technology Co., Ltd.
Ms. Pan also served as an Independent Director at Shenzhen Wote Advanced Materials Co., Ltd.
from 2018 to 2021.
Ms. Pan has a Master's in Business Administration from Renmin University of China and an undergraduate degree from Wuhan Finance School, which was conferred in 1968.
Postes actifs de Ling Man Pan
| Sociétés | Poste | Début |
|---|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | Director/Board Member | 01/02/2011 |
Anciens postes connus de Ling Man Pan
| Sociétés | Poste | Fin |
|---|---|---|
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Director/Board Member | 09/04/2021 |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Director/Board Member | - |
| SHENZHEN DANBOND TECHNOLOGY CO.,LTD. | Director/Board Member | - |
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Director/Board Member | - |
Formation de Ling Man Pan
| Renmin University of China | Masters Business Admin |
| Wuhan Finance School | Undergraduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 3 |
|---|---|
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Electronic Technology |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Health Technology |
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Process Industries |
| Entreprise privées | 2 |
|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | |
Shenzhen Danbond Technology Co., Ltd.
 Shenzhen Danbond Technology Co., Ltd. Electronic ComponentsElectronic Technology Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China. | Electronic Technology |
