Hansjörg Müller
Plus aucun poste en cours
Profil
Hansjörg Müller formerly worked at Schlatter Industries AG, as Head-Technology & Innovation and Besi Switzerland AG, as Project Manager in 1999.
Mr. Müller received his graduate degree from the University of Zurich.
Anciens postes connus de Hansjörg Müller
| Sociétés | Poste | Fin |
|---|---|---|
Besi Switzerland AG
 Besi Switzerland AG Containers/PackagingProcess Industries Part of BE Semiconductor Industries NV, Besi Switzerland AG is a Swiss company that develops assembly processes and equipment for leadframe, substrate, and wafer level packaging applications in various markets, including electronics, mobile internet, cloud server, computing, automotive, industrial, LED, and solar energy. The company is based in Cham, Switzerland. Besi Switzerland offers a range of products and services, including die attach, die bonding, flip chip, packaging molding, trim and form, singulation, accessories, and services. The company also provides process technology, chemistry and tooling, after-sales spares and tooling, customer support, and career opportunities. | Corporate Officer/Principal | 01/01/1999 |
| SCHLATTER INDUSTRIES AG | Directeur Technique/Scientifique/R&D | - |
Formation de Hansjörg Müller
| University of Zurich | Graduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 1 |
|---|---|
| SCHLATTER INDUSTRIES AG | Producer Manufacturing |
| Entreprise privées | 1 |
|---|---|
Besi Switzerland AG
Besi Switzerland AG Containers/PackagingProcess Industries Part of BE Semiconductor Industries NV, Besi Switzerland AG is a Swiss company that develops assembly processes and equipment for leadframe, substrate, and wafer level packaging applications in various markets, including electronics, mobile internet, cloud server, computing, automotive, industrial, LED, and solar energy. The company is based in Cham, Switzerland. Besi Switzerland offers a range of products and services, including die attach, die bonding, flip chip, packaging molding, trim and form, singulation, accessories, and services. The company also provides process technology, chemistry and tooling, after-sales spares and tooling, customer support, and career opportunities. | Process Industries |