Irmgard Bayerle
Investor Relations Contact chez ROODMICROTEC N.V.
Profil
Irmgard Bayerle is currently the Head-Investor Relations at RoodMicrotec NV since 2011.
Previously, he held the same position at Rood Testhouse International NV.
Postes actifs de Irmgard Bayerle
Sociétés | Poste | Début |
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ROODMICROTEC N.V. | Investor Relations Contact | - |
Anciens postes connus de Irmgard Bayerle
Sociétés | Poste | Fin |
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Rood Testhouse International NV
Rood Testhouse International NV Electronic Equipment/InstrumentsElectronic Technology Rood Testhouse International NV engages in development, production and service provision to the semiconductor industry which, includes testing semiconductors, optoelectronics, providing End-of-line manufacturing and service, developing test software for semiconductors, qualifying semiconductors and printed boards as well as printed boards assemblies. The company's services across wafer, packaged IC, printed board assembly, printed circuit board and interconnection technology, include, soldering, glueing, crimping covers: Engineering, test and programming Supply chain service and Qualification and failure analysis. The company was founded in 1976 and is headquartered in Zwolle, Netherlands. | Public Communications Contact | 03/08/2010 |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
Sociétés cotées | 1 |
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ROODMICROTEC N.V. | Commercial Services |
Entreprise privées | 1 |
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Rood Testhouse International NV
Rood Testhouse International NV Electronic Equipment/InstrumentsElectronic Technology Rood Testhouse International NV engages in development, production and service provision to the semiconductor industry which, includes testing semiconductors, optoelectronics, providing End-of-line manufacturing and service, developing test software for semiconductors, qualifying semiconductors and printed boards as well as printed boards assemblies. The company's services across wafer, packaged IC, printed board assembly, printed circuit board and interconnection technology, include, soldering, glueing, crimping covers: Engineering, test and programming Supply chain service and Qualification and failure analysis. The company was founded in 1976 and is headquartered in Zwolle, Netherlands. | Electronic Technology |