Daniel L. Donabedian
Directeur Général chez Invensas Bonding Technologies, Inc.
Profil
Daniel L.
Donabedian is currently the President & Chief Executive Officer at Invensas Bonding Technologies, Inc. and the Senior Vice President-Global Sales at Tessera Technologies LLC.
He previously held positions as President & Chief Executive Officer at Elpida Memory, Inc., Senior Vice President-Sales & Marketing at Microelectronics Assembly, Inc., and Manager-Manufacturing & Quality Program at US Air Force.
Donabedian holds an MBA degree from Framingham State College and an undergraduate degree from Massachusetts Maritime Academy.
Postes actifs de Daniel L. Donabedian
| Sociétés | Poste | Début |
|---|---|---|
Invensas Bonding Technologies, Inc.
 Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Directeur Général | - |
Tessera Technologies LLC
 Tessera Technologies LLC SemiconductorsElectronic Technology Tessera Technologies, Inc. develops and licenses innovative semiconductor, interconnect and imaging technologies. The company offers mobile computing and communications, memory and data storage and 3-D Integrated Circuit technologies. Tessera Technologies was founded in 1990 and is headquartered in San Jose, CA. | Sales & Marketing | - |
Anciens postes connus de Daniel L. Donabedian
| Sociétés | Poste | Fin |
|---|---|---|
Elpida Memory, Inc.
 Elpida Memory, Inc. SemiconductorsElectronic Technology Elpida Memory, Inc. manufactures Dynamic Random Access Memory (DRAM) integrated circuits. The company provides DRAM solutions across a wide range of applications, including personal computers, servers, mobile devices and digital consumer electronics. Its products include DDR3 SDRAM, Mobile RAM, GDDR and XDR DRAM. The company was founded on December 20, 1999 and is headquartered in Tokyo, Japan. | President | - |
| US Air Force | Corporate Officer/Principal | - |
| Microelectronics Assembly, Inc. | Sales & Marketing | - |
Formation de Daniel L. Donabedian
| Framingham State College | Masters Business Admin |
| Massachusetts Maritime Academy | Undergraduate Degree |
Expériences
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 5 |
|---|---|
Invensas Bonding Technologies, Inc.
Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Electronic Technology |
Tessera Technologies LLC
Tessera Technologies LLC SemiconductorsElectronic Technology Tessera Technologies, Inc. develops and licenses innovative semiconductor, interconnect and imaging technologies. The company offers mobile computing and communications, memory and data storage and 3-D Integrated Circuit technologies. Tessera Technologies was founded in 1990 and is headquartered in San Jose, CA. | Electronic Technology |
| Microelectronics Assembly, Inc. | |
Elpida Memory, Inc.
Elpida Memory, Inc. SemiconductorsElectronic Technology Elpida Memory, Inc. manufactures Dynamic Random Access Memory (DRAM) integrated circuits. The company provides DRAM solutions across a wide range of applications, including personal computers, servers, mobile devices and digital consumer electronics. Its products include DDR3 SDRAM, Mobile RAM, GDDR and XDR DRAM. The company was founded on December 20, 1999 and is headquartered in Tokyo, Japan. | Electronic Technology |
| US Air Force | Government |
