Takashi Shiraishi
Directeur/Membre du Conseil chez Casio Micronics Co., Ltd.
Provenance du réseau au premier degré de Takashi Shiraishi
Entité | Type d'entité | Industrie | |
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Casio Micronics Co., Ltd.
Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry.
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| Subsidiary | Semiconductors | 4 |
Graphique Sociétés connectées au second degré
Relation dans plusieurs entreprises
Sociétés connectées à Takashi Shiraishi via son réseau personnel
Société | Secteur | Personnes liées | Poste principal |
---|---|---|---|
CASIO COMPUTER CO., LTD. | Electronics/Appliances | Director/Board Member |
Statistiques
Internationale
Japon | 2 |
Sectorielle
Consumer Durables | 2 |
Opérationnelle
Director/Board Member | 5 |
Corporate Officer/Principal | 2 |
President | 1 |
Independent Dir/Board Member | 1 |
Chief Administrative Officer | 1 |
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