Peter Elenius
Fondateur chez E&G Technology Partners LLC
Profil
Peter Elenius is the founder of E&G Technology Partners LLC.
Prior to founding E&G Technology Partners LLC, he worked as a Product Manager at Kulicke & Soffa Industries, Inc. and as a Manager-Advisory Engineering at IBM Microelectronics, Inc. He also served as the Chief Technology Officer & Vice President at FlipChip International LLC.
Mr. Elenius received his undergraduate and graduate degrees from the University of Wisconsin.
Postes actifs de Peter Elenius
| Sociétés | Poste | Début |
|---|---|---|
E&G Technology Partners LLC
 E&G Technology Partners LLC Information Technology ServicesTechnology Services E&G Technology Partners LLC engages in technology commercialization and business development. Its services include flip chip & wafer level package consultation and market & business development. The company was founded by Peter Elenius and Thomas Goodman and is headquartered in Tempe, AZ. | Fondateur | - |
Anciens postes connus de Peter Elenius
| Sociétés | Poste | Fin |
|---|---|---|
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Directeur Technique/Scientifique/R&D | 01/03/2002 |
IBM Microelectronics, Inc.
 IBM Microelectronics, Inc. SemiconductorsElectronic Technology IBM Microelectronics, Inc. develops and markets customized semiconductor products and services. The company also develops, manufactures and test leading-edge semiconductor packaging technologies to develop future semiconductor products and processes. IBM Microelectronics was founded in 1964 and is headquartered in White Plains, NY. | Corporate Officer/Principal | 01/01/1994 |
| KULICKE AND SOFFA INDUSTRIES, INC. | Corporate Officer/Principal | - |
Formation de Peter Elenius
| University of Wisconsin | Undergraduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 1 |
|---|---|
| KULICKE AND SOFFA INDUSTRIES, INC. | Producer Manufacturing |
| Entreprise privées | 3 |
|---|---|
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |
IBM Microelectronics, Inc.
IBM Microelectronics, Inc. SemiconductorsElectronic Technology IBM Microelectronics, Inc. develops and markets customized semiconductor products and services. The company also develops, manufactures and test leading-edge semiconductor packaging technologies to develop future semiconductor products and processes. IBM Microelectronics was founded in 1964 and is headquartered in White Plains, NY. | Electronic Technology |
E&G Technology Partners LLC
E&G Technology Partners LLC Information Technology ServicesTechnology Services E&G Technology Partners LLC engages in technology commercialization and business development. Its services include flip chip & wafer level package consultation and market & business development. The company was founded by Peter Elenius and Thomas Goodman and is headquartered in Tempe, AZ. | Technology Services |
