Huai Jun Gao
Président chez Lansus Technologies, Inc.
Postes actifs de Huai Jun Gao
| Sociétés | Poste | Début | Fin |
|---|---|---|---|
Lansus Technologies, Inc.
 Lansus Technologies, Inc. Telecommunications EquipmentElectronic Technology Lansus Technologies, Inc. engages in the research, development, design and sale of radio frequency (RF) front-end chips. It provides 5G modules, 4G power amplifiers (PAs) & modules, 2G-3G PAs & modules, RF switches and ubiquitous connectivity products. The company was founded by Hua Long on May 15, 2015 and is headquartered in Shenzhen, China. | Président | 01/05/2021 | - |
Historique de carrière de Huai Jun Gao
Formation de Huai Jun Gao
| Anhui Normal University | Undergraduate Degree |
Statistiques
Internationale
| Chine | 3 |
Opérationnelle
| Chairman | 1 |
| Undergraduate Degree | 1 |
Sectorielle
| Electronic Technology | 2 |
| Consumer Services | 2 |
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
| Entreprise privées | 1 |
|---|---|
Lansus Technologies, Inc.
Lansus Technologies, Inc. Telecommunications EquipmentElectronic Technology Lansus Technologies, Inc. engages in the research, development, design and sale of radio frequency (RF) front-end chips. It provides 5G modules, 4G power amplifiers (PAs) & modules, 2G-3G PAs & modules, RF switches and ubiquitous connectivity products. The company was founded by Hua Long on May 15, 2015 and is headquartered in Shenzhen, China. | Electronic Technology |
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