Profil
G.
William Knapp is Vice President of Engineering for Ziptronix, Inc. He was Vice President of Development for Conexant/Mindspeed.
He was Vice President of Advanced Network Processing Products for Vitesse Semiconductor Corporation.
He received an undergraduate degree from the University of Cincinnati and a graduate degree from North Carolina State University.
Anciens postes connus de G. William Knapp
| Sociétés | Poste | Fin |
|---|---|---|
Invensas Bonding Technologies, Inc.
 Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Corporate Officer/Principal | - |
Formation de G. William Knapp
| North Carolina State University | Graduate Degree |
| University of Cincinnati (Ohio) | Undergraduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 1 |
|---|---|
Invensas Bonding Technologies, Inc.
Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Electronic Technology |
