Yoshihisa Morofuji

Osaki Engineering Co., Ltd. engages in the development, manufacture, and sale of equipment using fine pitch technology. It operates through the following divisions: Sensor & High Performance Device; Energy & Lighting; and Flat Panel Display. The Sensor & High Performance Device division consists of camera module assembly equipment, flip chip bonder, die bonder, and ball bump-related devices. The Energy & Lighting division includes battery assembly and adjusting devices, lighting module, assembly equipment, and various adjustments and inspection equipment. The Flat Panel Display division deals with the mounting equipment and anisotropic conductive film attachment devices. The company was founded on April 26, 1990 and is headquartered in Iruma, Japan.