Bruce W. Hueners
Directeur Général chez Palomar Technologies, Inc.
Profil
Bruce W.
Hueners is currently the President & Chief Executive Officer at Palomar Technologies, Inc. He previously worked as a Principal at GE Aerospace.
He completed his undergraduate degree at the University of Southern California and holds an MBA from Indiana University.
Postes actifs de Bruce W. Hueners
| Sociétés | Poste | Début |
|---|---|---|
Palomar Technologies, Inc.
 Palomar Technologies, Inc. Electronic Production EquipmentElectronic Technology Palomar Technologies, Inc. provides die attach systems and processes. It offers micro- and optoelectronic packaging and assembly systems and solutions, die and wire bonders, wire bonding technology, automated dispense and encapsulation systems, automated plasma cleaners, die ejectors and bond testing equipment, semi-automated and manual bonders, laser interferometers, automated production lines, refurbished systems, and bonder buy-back programs; and VisionPilot, a geometric pattern matching software for automated die attach. The company was founded in 1975 and is headquartered in Carlsbad, CA. | Directeur Général | 01/01/2007 |
Anciens postes connus de Bruce W. Hueners
| Sociétés | Poste | Fin |
|---|---|---|
| GE AEROSPACE | Corporate Officer/Principal | - |
Formation de Bruce W. Hueners
| Indiana University | Masters Business Admin |
| University of Southern California | Undergraduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 1 |
|---|---|
| GE AEROSPACE | Producer Manufacturing |
| Entreprise privées | 1 |
|---|---|
Palomar Technologies, Inc.
Palomar Technologies, Inc. Electronic Production EquipmentElectronic Technology Palomar Technologies, Inc. provides die attach systems and processes. It offers micro- and optoelectronic packaging and assembly systems and solutions, die and wire bonders, wire bonding technology, automated dispense and encapsulation systems, automated plasma cleaners, die ejectors and bond testing equipment, semi-automated and manual bonders, laser interferometers, automated production lines, refurbished systems, and bonder buy-back programs; and VisionPilot, a geometric pattern matching software for automated die attach. The company was founded in 1975 and is headquartered in Carlsbad, CA. | Electronic Technology |
