Communiqués Chipbond Technology Corporation

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Cours en clôture Taipei Exchange 01/10/2026			Varia. 5j.	Varia. 1 janv.
225,50 ^TWD	+7,64%		+5,13%	+318,37%

30/07	Chipbond Technology Corporation publie ses résultats pour le deuxième trimestre et le premier semestre clos le 30 juin 2026	CI
30/04	Chipbond Technology Corporation publie ses résultats pour le premier trimestre clos le 31 mars 2026	CI

29/07/22	Chipbond Technology : The Company announced Board has approved Q2 of 2022 consolidated financial report	PU
17/06/22	Chipbond Technology : To announce Chairman of the Company set up the ex-dividend record date.	PU
09/06/22	Chipbond Technology : To announce the Company acquires a batch of NT$500 million machinery equipment	PU
29/04/22	Chipbond Technology : The Company announced Board has approved Q1 of 2022 consolidated financial report	PU
15/04/22	Chipbond announces supplemental information on 2022 Annual General Shareholders' Meeting (Method of Convening the Meeting: Physical Shareholders' Meeting)	PU
15/04/22	Chipbond Technology : Board Meeting Resolution on dividend distribution	PU
22/03/22	Chipbond Technology : To announce the Company acquires a batch of NT$500 million machinery equipment	PU
25/02/22	Chipbond Technology : The Company announced Board has approved Q4 of 2021 consolidated financial report	PU
25/02/22	Chipbond Technology : Board of Directors resolved to convene 2022 Annual Shareholders' Meeting	PU