Communiqués Cadence Design Systems, Inc.

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US1273871087

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Temps réel estimé Cboe BZX 16:10:54 17/09/2026			Varia. 5j.	Varia. 1 janv.
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15/09	Cadence et Analog Devices développent la nouvelle génération de processeurs audio automobiles SHARC	CI
09/09	Transcript : Cadence Design Systems, Inc. Presents at Goldman Sachs Communacopia + Technology Conference 2026, Sep-09-2026 10:50 AM

Communiqués

16/09	Cadence Tensilica IP Powers Analog Devices' Next-Generation DSP Architecture	AQ
15/09	Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture	BU
03/09	Cadence's Anirudh Devgan to Present at Goldman Sachs Communacopia + Technology Conference	AQ
02/09	Cadence’s Anirudh Devgan to Present at Goldman Sachs Communacopia + Technology Conference	BU
01/09	Cadence Subsystem for PCIe 6.0 Architecture Achieves First-Pass PCI Express Specification Compliance	BU
19/08	Cadence to Present at Deutsche Bank Technology Conference	BU
27/07	Cadence Design : Second Quarter 2026 2026 Q2 CFO Commentary	PU
27/07	Cadence: Q2 Earnings Snapshot	AQ
27/07	Cadence Reports Second Quarter 2026 Financial Results	BU
17/07	Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design	BU
16/07	Cadence Introduces AuraStack AI Super Agent, the World's First Agentic AI Platform for PCB and Advanced Packaging	AQ
16/07	Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging	BU
06/07	Cadence Announces Second Quarter 2026 Financial Results Webcast	BU
17/06	Cadence Design : Accelerates Digital Twin-Driven Data Center AI Modernization with HPE	PU
08/06	Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs	BU
03/06	Cadence's Richard Gu to Present at Nasdaq Conference	AQ
02/06	Cadence’s Richard Gu to Present at Nasdaq Conference	BU
01/06	Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA	BU
29/05	Cadence and Samsung Foundry Deepen 2nm and 3D-IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand	AQ
28/05	Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand	BU
26/05	Cadence’s Anirudh Devgan to Present at BofA Conference	BU
11/05	Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency	BU
28/04	Cadence Design : First Quarter 2026 2026 Q1 Prepared Remarks	PU
27/04	Cadence: Q1 Earnings Snapshot	AQ
27/04	Cadence Reports First Quarter 2026 Financial Results	BU