Communiqués Cadence Design Systems, Inc.

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Marché Fermé - Nasdaq 22:00:00 25/09/2026			Varia. 5j.	Varia. 1 janv.
326,13 ^USD	+1,28%		+15,28%	+4,33%

23/09	Cadence étend son partenariat avec Taiwan Semiconductor Manufacturing pour faire progresser ses capacités de fabrication de puces	MT
23/09	Les solutions de Cadence Design Systems, Inc. aident Global Unichip Corp. à fournir des puces sur mesure de pointe pour des accélérateurs d’IA et des systèmes hyperscale sur les technologies de procédé de pointe de TSMC	CI

Communiqués

23/09	Cadence Collaborates With TSMC to Deliver Certified Tool Solutions and Industry-Leading, Silicon-Proven UALink IP on TSMC Advanced Processes	BU
22/09	Cadence Expands ChipStack AI Super Agent with a New Agent for RTL Generation and Early PPA Optimization	BU
16/09	Cadence Tensilica IP Powers Analog Devices' Next-Generation DSP Architecture	AQ
15/09	Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture	BU
03/09	Cadence's Anirudh Devgan to Present at Goldman Sachs Communacopia + Technology Conference	AQ
02/09	Cadence’s Anirudh Devgan to Present at Goldman Sachs Communacopia + Technology Conference	BU
01/09	Cadence Subsystem for PCIe 6.0 Architecture Achieves First-Pass PCI Express Specification Compliance	BU
19/08	Cadence to Present at Deutsche Bank Technology Conference	BU
27/07	Cadence Design : Second Quarter 2026 2026 Q2 CFO Commentary	PU
27/07	Cadence: Q2 Earnings Snapshot	AQ
27/07	Cadence Reports Second Quarter 2026 Financial Results	BU
17/07	Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design	BU
16/07	Cadence Introduces AuraStack AI Super Agent, the World's First Agentic AI Platform for PCB and Advanced Packaging	AQ
16/07	Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging	BU
06/07	Cadence Announces Second Quarter 2026 Financial Results Webcast	BU
17/06	Cadence Design : Accelerates Digital Twin-Driven Data Center AI Modernization with HPE	PU
08/06	Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs	BU
03/06	Cadence's Richard Gu to Present at Nasdaq Conference	AQ
02/06	Cadence’s Richard Gu to Present at Nasdaq Conference	BU
01/06	Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA	BU
29/05	Cadence and Samsung Foundry Deepen 2nm and 3D-IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand	AQ
28/05	Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand	BU
26/05	Cadence’s Anirudh Devgan to Present at BofA Conference	BU
11/05	Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency	BU
28/04	Cadence Design : First Quarter 2026 2026 Q1 Prepared Remarks	PU